• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention provides a semiconductor processing process control system that can flexibly and quickly respond to changes in processing processes, calculation of control variables, and processing devices. Calculation of control variables for obtaining control conditions of the semiconductor processing apparatus and the process control body unit 100 for controlling the semiconductor processing process irrespective of the target processing contents and the semiconductor processing apparatus and the semiconductor processing apparatus suitable for the target processing contents. From the program 210, a semiconductor processing process control system is configured. The control variable calculation program 210 is used by plugging in the process control main body 100 what is necessary. When the semiconductor processing apparatus or its processing contents are changed, only the control variable calculation program 210 needs to be changed.
    公开号:KR20010029860A
    申请号:KR1020000036356
    申请日:2000-06-29
    公开日:2001-04-16
    发明作者:하라까와쇼이찌；이께다마꼬또；후꾸다에쯔오
    申请人:니시무로 타이죠；가부시끼가이샤 도시바；
    IPC主号:
    专利说明:

    A CONTROL SYSTEM OF SEMICONDUCTOR PROCESSING PROCEDURE AND A METHOD THEREOF, AND A RECORDING MEDIA WHICH A PROCESSING THEREFOR IS RECORDED}
    BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor processing process control system, a semiconductor processing process control method, and a recording medium on which a process therefor is recorded, and in particular, a semiconductor capable of flexibly and quickly responding to changes in a processing process, a control variable calculation method, and a processing apparatus. A processing process control system, a semiconductor processing process control method, and a recording medium on which the processing therefor is recorded.
    In manufacturing semiconductor devices such as ICs and LSIs, it is necessary to go through a number of processing steps such as film formation, etching, cleaning, and inspection, and target processing is performed in each step. In order to realize the target process, it is necessary to appropriately set the control conditions and the processing time of each processing device.
    For example, when performing a film-forming process in a process, the material (film type) and film thickness of a film | membrane become the process target. Here, the film formation of the target film type in a specific semiconductor is called processing content. By appropriately selecting the control conditions of the film forming apparatus (conditions such as the gas material to be used, the flow rate of the gas, and the temperature of the CVD apparatus), the target processing contents (film forming of the target film type) can be realized, and the film forming process is performed. The film thickness can be controlled by the time (deposition time). Here, the deposition time is determined by dividing the target film thickness by the film formation rate (film thickness deposited in unit time, that is, a kind of processing speed). In addition, the film-forming rate is previously measured at the time of apparatus maintenance, etc., and is stored as a rate table.
    In addition, when performing an etching process, etching of the film | membrane of the specific material formed into a specific semiconductor is a process content, and this process content and the depth (film thickness) of an etching are a process target. In order to realize this processing content, the control conditions of the etching apparatus are determined. In addition, the etching time (processing time) is determined by dividing the target etching depth (film thickness) by the etching rate (etch depth per unit time, that is, a kind of processing speed). The etching rate is stored as a rate table as in the case of film formation.
    A semiconductor processing process control system is used to manage the control conditions and processing time of the processing apparatus in a plurality of processing steps. Here, the case where film formation (in the case of a single process) is taken as an example of the process contents, and the flow of process control by the conventional semiconductor processing process control system is shown. The process flow is shown in FIG. 29 and the flow of process control is shown in FIG.
    As shown in Fig. 30, the semiconductor processing step control system reads the processing target (film type to be formed in this case, the film thickness) and the control conditions of the processing apparatus in the self process from the process flow information. The processing time (in this case, deposition time) is obtained by dividing the target film thickness by the film forming rate with reference to the rate table. In this example, the deposition time is 100 minutes obtained by dividing the target film thickness 1000 by the film formation rate 10 angstroms / minute. Then, the film forming process is performed by sending control variables (condition setting relating to the control of the processing apparatus including both the control conditions of the processing apparatus and the processing time, and the following also) to the film forming apparatus or the control apparatus thereof. In this example shown in FIG. 30, the control method for the target processing step is fixed.
    31 and 32 show methods for calculating processing time when forming a plurality of films and when etching a plurality of films. In this case, since the control conditions and the processing speed (film formation rate, etching rate, etc.) of the processing apparatus differ depending on the material of the film to be formed or etched, it is necessary to calculate the processing time for each process of processing each film.
    The semiconductor processing step control system may be constituted by hardware itself, but can usually be configured as a program (software) on a computer so as to quickly cope with changes in the processing step. This is shown in FIG.
    As shown in FIG. 33, there is a process control program for each processing apparatus used for each process, and each processing apparatus is controlled. That is, the function of the semiconductor processing process control system is realized by the collection of a plurality of process control programs. When the process or the apparatus used therein is changed, the contents of each process control program can be changed to cope with this.
    However, there is a problem that the control condition is not fixed which is determined only by the apparatus and the processing contents, and that the deposition rate is not necessarily constant.
    In other words, the control condition may change depending on the usage history of the processing apparatus or the like. In addition, the film-forming rate can change with the state of the base material to form into a film, and accordingly, the film-forming rate may change with the thickness of the film | membrane deposited.
    As a method of coping with this, for example, a method of calculating appropriate control conditions in consideration of past control conditions is disclosed in Japanese Patent Laid-Open No. Hei 8-45804, and a method of calculating a processing time from a target film thickness is disclosed. -196404.
    Such a control condition and a calculation method of the processing time are not necessarily determined but can be changed depending on the target processing contents and the like. In the conventional semiconductor process control system, there is a problem that it is not possible to flexibly cope with such a change in the calculation method of the control condition and the processing time, and the whole program can be produced to the extent that the calculation method is changed.
    In addition, even when the processing apparatus and the processing process are changed (including the deletion and addition of the process in addition to the change of the individual processes), there is a problem that it takes time to change the entire program.
    As stated above, in the conventional semiconductor processing step control system, it is not possible to respond quickly to changes in the processing step, the calculation method of the control variable, the processing device, etc., and as a result, there is a possibility of causing a delay in the development of the semiconductor device.
    Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor processing step control system that can flexibly and quickly respond to changes in the processing step, control variable calculation method, and processing device.
    1 is a diagram illustrating an example of a configuration block and an operation according to the present invention.
    2 is a diagram illustrating an example of a program module according to the present invention.
    3 is a diagram illustrating a processing flow of a semiconductor.
    4 is a diagram illustrating an example of a hardware configuration according to the present invention.
    5 is a block diagram showing a first example of a control condition calculation unit according to the present invention.
    6 is a block diagram showing a second example of a control condition calculation unit according to the present invention.
    7 is a block diagram showing details of a process control body according to the present invention.
    8 is a diagram showing a flow of processing in the process control body according to the present invention.
    Fig. 9 is a diagram showing the flow of data when the present invention is implemented.
    10 is a diagram showing a processing flow in the case of calculating the processing time in the film forming step using the present invention.
    It is a figure which shows the structural block and the example of operation | movement of the control variable calculation part which concerns on 2nd Embodiment of this invention.
    It is a figure which shows the detail of the process control main body part which concerns on the 2nd Embodiment of this invention.
    It is a figure which shows the flow of data concerning the 2nd Embodiment of this invention.
    It is a figure which shows the example of process information and physical step information which concerns on 3rd Embodiment of this invention.
    It is a figure which shows the calculation example of the processing time which concerns on the 3rd Embodiment of this invention.
    It is a figure which shows the flow of a process concerning the 4th Embodiment of this invention.
    It is a figure which shows the flow of data which concerns on 4th embodiment of this invention.
    18 is a diagram showing an example of a computer program according to the fourth embodiment of the present invention.
    It is a figure which shows the functional block which concerns on the 5th Embodiment of this invention.
    20 is a diagram illustrating a hardware configuration according to the fifth embodiment of the present invention.
    It is a figure which shows the functional block which concerns on the 5th Embodiment of this invention.
    Fig. 22 is a diagram showing the operation of the skip determination request receiving unit in the fifth embodiment of the present invention.
    It is a figure which shows the operation | movement of the target process skip determination part in the 5th Embodiment of this invention.
    It is a figure which shows the judgment logic of a judgment plug-in in 5th Embodiment of this invention.
    It is a figure which shows the operation | movement of a specification search part in the 5th Embodiment of this invention.
    It is a figure which shows the operation | movement of the target process QC result extraction part in 5th Embodiment of this invention.
    FIG. 27 is a diagram showing operations of the target process skip determination unit and the skip execution unit in the fifth embodiment of the present invention.
    FIG. 28 is a diagram showing an example of the operation in the case where the history of the skip determination is recorded as know-how data in the fifth embodiment of the present invention and information is provided to the external device.
    It is a figure which shows the process flow in a conventional Example.
    It is a figure which shows the flow of process control in a conventional Example.
    Fig. 31 is a diagram showing a conventional processing time calculation method in the case of forming a plurality of films.
    32 is a diagram illustrating a conventional processing time calculation method in the case of etching a plurality of films.
    33 is a diagram illustrating a configuration concept of a conventional semiconductor processing process control system.
    <Explanation of symbols on main parts of the drawing>
    100: process control body
    110: process judgment
    120: process information acquisition unit
    130: control variable transceiver
    140: control calculation selector
    150: temporary storage of data
    200: control variable calculation unit
    210: control variable calculation program
    2l0A: Compute Management
    210B: Formula
    211: control calculation program
    212: Actual Aggregation Program
    220: control variable calculation method
    221: multi-process calculation technique program
    300: process management department
    400: semiconductor manufacturing apparatus (semiconductor processing apparatus)
    401: semiconductor inspection device (semiconductor processing device)
    510: process control main server
    520: QC data server
    530: process management server
    540: processing unit control server
    70: process skip device
    71: skip determination request receiving unit
    72: skip judgment
    73: judgment execution unit
    74: judgment result receiver
    75: skip execution unit
    76: judgment result register
    80: Judgment Plug-in
    81: specification database
    82: specification search unit
    83: result extraction unit
    84: skip determination unit
    85: cache database
    90: external system
    MEANS TO SOLVE THE PROBLEM In order to solve the said subject, the semiconductor processing process control system which concerns on this invention is a process control main body part which performs control of a semiconductor processing process irrespective of a semiconductor processing apparatus and a processing target, and the said semiconductor processing apparatus and a preprocessing target are suitable. Control variable calculating means for obtaining a control variable of the semiconductor processing apparatus, wherein the control variable calculating means includes a plurality of the control variable calculating means existing in accordance with the semiconductor processing apparatus and the processing target; It is characterized in that it is configured to be able to pull out and plug in as needed.
    Moreover, the semiconductor processing process control system which concerns on this invention is a process control main body part which controls a semiconductor processing process irrespective of a semiconductor processing apparatus and a processing target, and control of the said semiconductor processing apparatus and a semiconductor processing apparatus suitable for the said processing target. And a plurality of control variable calculation means for obtaining a variable, and a control variable calculation method for managing the plurality of control variable calculation means in accordance with a calculation method covering a plurality of predetermined processing steps. And the process control main body unit can be pulled out and plugged in as needed, and the control variable calculating means is configured to be pulled out and plugged in as required.
    In this case, the control variable calculation means may include a control calculation unit that performs calculation of control variables of the semiconductor processing apparatus only, and an actual processing aggregation unit that performs calculation based on processing data from the semiconductor processing apparatus. good.
    Further, the control variable calculation means may include a calculation management unit that manages the flow of control variable calculation processing and a calculation expression unit including a set of calculation formulas used by the calculation management unit.
    On the other hand, the process control main unit includes a flow information acquisition unit for acquiring process flow information, a process determination unit for acquiring specific information for specifying the semiconductor processing apparatus, processing contents, and process state from the process flow information, and the specification; A control variable selection means for selecting a control variable calculation means suitable for it based on the information, starting the control variable selection execution unit, and a control variable transmission unit for receiving the control variable obtained by the calculation of the started control variable calculation means and sending it to the semiconductor processing apparatus. It may be included.
    The control variable calculating means may obtain the processing speed information based on the specific information and calculate the processing time from the processing speed.
    In addition, when the control variable calculating means acquires the information of the processing speed, processing conditions and processing target film types are obtained from the processing contents in the specific information, and based on these processing conditions and processing film types. Information of the processing speed may be obtained.
    On the other hand, the apparatus further includes a corresponding information data section having corresponding data between the logical step processing corresponding to the processing condition and the physical step processing consisting of all processing steps necessary for the control of the semiconductor processing apparatus based on the logical step processing. You can do that.
    Further, the control variable calculating means includes first control variable calculating means having a function of acquiring the processing data by the semiconductor processing apparatus and storing it in the data temporary storage section, and the processing stored in the data temporary storage section. A second control variable calculating means having a function of judging whether or not part of the processing step is omitted based on the data may be included.
    The semiconductor processing control apparatus according to the present invention includes a skip determination request receiving unit for receiving a request for eliminating determination of a process, a plurality of detachable determination plug-ins having process elimination determination logic corresponding to each process, and an elimination determination target process. The skip determination unit searching for the corresponding decision plug-in, the judgment execution unit for starting the judgment plug-in, the decision result receiving unit for receiving the process omission determination result of the judgment plug-in, and the process omission determination result may be judged as possible. It is characterized by including a skip execution part which skips a process at the time.
    In this case, the determination plug-in may include: a specification database consisting of a set of reference specifications for the process omission determination, a specification search unit which obtains a reference specification from the specification database according to the instruction from the determination execution unit and sends it to the skip determination unit; And a QC result extracting unit which obtains quality information from an external quality control database and sends it to a skip judging unit, and a decision to skip a process based on the reference specification and the quality information. You may include a determination part.
    It is also possible to further include a know-how database for accumulating the result of the process omission determination and a transmission means for transmitting the data of the know-how database to the outside.
    The semiconductor processing step control method according to the present invention is a semiconductor processing step control method for controlling a plurality of semiconductor processing devices, and the specific information for specifying the semiconductor processing device, the processing contents and the process state to be processed by the process flow information is specified. Control calculation selection which selects the control variable calculation suitable for it based on the said specific information among the process determination process acquired, the said semiconductor processing apparatus, the said process content, and the some control variable calculation which differs for the said process state, and performs calculation, And a control variable transmission step of receiving the control variable obtained by the execution step and the control variable calculation and sending it to the semiconductor processing apparatus.
    A recording medium according to the present invention is a recording medium in which a program for controlling a plurality of semiconductor processing apparatuses is recorded, and acquires, from process flow information, specific information specifying the semiconductor processing apparatus, processing contents, and process state to be processed. Execution of control calculation selection which selects a control variable calculation suitable for it based on said specific information among the process determination process to perform, and the said semiconductor processing apparatus, the said process content, and the some control variable calculation which differs for every said process state, and performs calculation, A program for receiving a control variable obtained by the step and the control variable calculation and sending the control variable sending step to the semiconductor processing apparatus is recorded.
    [First embodiment]
    1st Embodiment of this invention is a semiconductor process process control system which consists of a process control main body part and a control variable calculation program, and uses a control variable calculation program by a process process. It demonstrates in detail below.
    The structural block of this embodiment is shown to Fig.1 (a). The process control main body 100 is coupled with a control variable calculation section 200 having a plurality of control variable calculation programs 210. Each of the control variable calculation programs 210 constitutes the control variable calculation means in the present embodiment.
    The process control main body 100 is connected to the process management unit 300 and one or a plurality of semiconductor manufacturing apparatuses 400 or semiconductor inspection apparatuses 402. The semiconductor manufacturing apparatus 400 and the semiconductor test | inspection apparatus 402 comprise the semiconductor processing apparatus in this embodiment.
    The process management unit 300 is a host system computer that manages the entire process flow, and transmits process flow information to the process body control main body unit 100. This process flow information is also called context information, and is information which shows the order of the processing process performed by the semiconductor manufacturing apparatus 400 or the semiconductor inspection apparatus 402, and the content of the process targeted by each processing process.
    The process control main body 100 is a component that does not depend on the semiconductor manufacturing apparatus 400, the semiconductor inspection apparatus 402, or the recipe. Control variable calculation programs 210 (1) to 21O (n) are calculation units for calculating control variables of the processing apparatus. A feature of the present embodiment is that any of the control variable calculation programs 210 (1) to 210 (n) created for each recipe can be selected and plugged into the process control main body unit 100. That is, the control variable calculation programs 210 (1) to 210 (n) are configured to be able to be pulled out and inserted into the process control main body unit 100. Here, as a recipe, the control variable calculation program 210 may be different in the case where the varieties of the devices are the processing conditions under which the processing is performed, and even when the same recipe is used, the position and the order used in the varieties and the process flows are different. have.
    FIG. 1B is a diagram illustrating a relationship between the process flow and the control variable calculation program 210. In response to the process i, the control variable calculation program 210 (i) is applied. The function of the control variable calculation program 210 can be described by the program. The specific example is shown in FIG. In addition, in the whole process flow of a semiconductor process, as shown in FIG. 3, since an inspection process is included in addition to a process (manufacturing) process, here, "process" includes an inspection, and if any process is an inspection process, It is also assumed that the control variable calculation program 210 (i) is appropriately replaced by this.
    4 is a diagram illustrating a hardware configuration of the semiconductor processing step control system according to the present embodiment. As shown in FIG. 4, the semiconductor processing process control system includes a process control main server 510, a process control department 512, a QC (quality control) data server 520, and a process management server ( 530 and device control servers 540 (1) to 540 (n) are interconnected via a network.
    The process control server 510, the QC data server 520, and the process management server 530 are connected to an auxiliary storage device having a database. At this time, the process control body unit 100 and the control variable calculation program 210 correspond to the process control server 510, and the process management unit 300 corresponds to the process management server 530. The control unit of the semiconductor manufacturing apparatus 400 or the semiconductor inspection apparatus 402 is connected to the device control server 540.
    The control variable calculation program 210, as shown in Figs. 5A and 5B, is a calculation management unit 210A for managing the flow of the order and processing for calculating the control variable, and a calculation formula used for the calculation of the control variable. It is divided into the calculation formula part 210B which consists of. Since the calculation management unit 210A differs depending on the device and the recipe, the calculation management unit 210A exists for each device or recipe. The calculation expression unit 210B can be described in the control variable calculation program 210 in this manner, but it is also possible to call and use an expression of an external application (link with an external program).
    In addition, the control variable calculation program 210, as shown in Fig. 6, is a control calculation program 211 that performs purely calculation of control variables of the processing apparatus, processing of the processing status data of the processing apparatus, temporary storage, and their It can also be separated into the actual processing aggregation program 212 which calculates the device constant of the processing apparatus based on the data. Even in this case, the control calculation program 211 and the actual processing aggregation program 212 can be divided into the calculation management units 211A and 212A and the calculation expression units 211B and 212B, respectively.
    Next, the detail of the process control main body 100 is shown in FIG. As shown in FIG. 7, the process control main body 100 includes a process determination unit 110, a flow information acquisition unit 120, a control variable transmission and reception unit 130, a control calculation selection execution unit 140, And a data temporary storage unit 150.
    The process determination unit 110 is tied to the flow information acquisition unit 120, the control variable transmission / reception unit 130, and the control calculation selection execution unit 140. The control calculation selection unit 140 is also connected to the control variable transmission / reception unit 130 and the data temporary storage unit 150, and constitutes the process control body unit 100 as a whole. The control calculation selection execution unit 140 can select and plug in any control variable calculation program from a plurality of control variable calculation programs 210 (1) to (210) (n).
    The control variable calculation programs 210 (1) to 210 (n) are selected by the process control main body 100. The flowchart of this process is shown in FIG.
    In the process flow information, information that can determine the target device or the target device to be processed, and information that can determine the recipe or recipe used in the target device are registered. For this reason, as shown in FIG. 8, the process determination part 110 acquires this process information from the flow information acquisition part 120, and acquires the target apparatus name and recipe name (step S10). Subsequently, in the control calculation selection execution unit 140, from the acquired device name and recipe name, the control variable calculation program 210 corresponding to the control variable calculation program 210 is managed using the device recipe management table managing the device and the recipe. Search is performed (step S11). That is, the device recipe management table is a table which combines a device group name, a device name and a recipe name, and manages the correspondence with the control calculation program corresponding to it.
    Next, as a result of this search, it is judged whether or not the corresponding control variable calculation program 210 exists (step S12). If the corresponding control variable calculation program 210 exists, the control variable calculation program 210 is called on the memory and the parameter necessary for calculation is exchanged to execute the control variable calculation program (step S13).
    When the calculation processing of the control variable calculation program has ended, it is determined whether the control variable calculation program 210 has ended normally (step S14). If it is normally terminated, the calculation result is output to the control variable transmission / reception unit 130 to end this processing. Further, this process ends even when the control variable calculation program 210 corresponding to step S12 does not exist or when the control variable calculation program 210 does not end normally in step S14.
    Next, based on FIG. 9 which shows the data flowchart which described the flow mentioned above in detail, the process content of a semiconductor processing process control system is demonstrated in more detail. In this FIG. 9, as shown in FIG. 6, the control variable calculation program 210 is divided into the control calculation program 211 and the actual processing aggregation program 212.
    First, process flow information is transmitted from the process management unit 300 to the flow information acquisition unit 120 of the process control body unit 100. The flow information acquisition unit 120 transmits this process flow information to the process determination unit 110. The process determination unit 110 determines the processing state, the process, the apparatus, and the like based on this process flow information. This determined information (process state such as process start, apparatus, etc.) is given to the control calculation selection execution unit 140.
    The control calculation selection execution unit 140 selects the control calculation program 211 based on the information such as the process information, the apparatus, the processing status, and starts this. The started control calculation program 211 refers to the data in the data temporary storage section 150 and the various data in the QC database 232 and performs calculation. The calculation result obtained by this control calculation program 211 is transmitted to the control calculation selection execution unit 140. And this calculation result is transmitted to the semiconductor manufacturing apparatus 400 (or the semiconductor test | inspection apparatus 402) after the control variable transmitting-and-receiving part 130 is substituted by the control parameter suitable for each apparatus.
    In the above-described processing, when the judgment processing state of the process judging unit 110 is the end of the processing and the end of the inspection, the control calculation selection execution unit 140 starts the actual processing aggregation program 212 for performing the actual processing aggregation. do. In this actual processing counting program 212, it is described, for example, to acquire some kind of processing data (for example, film thickness and actual processing data) from the apparatus.
    In this way, the control variable transceiver unit 130 receives the processing data from the semiconductor manufacturing apparatus 400 (or the semiconductor inspection apparatus 402). This process data is transmitted to the control calculation selection execution unit 140. Moreover, the flow information acquisition part 120 acquires process flow information from the process management part 300 as needed. This process flow information contains process management information. For this reason, the flow information acquisition part 120 extracts process management information from process flow information, and transmits it to the control calculation selection execution part 140.
    The control calculation selection execution unit 140 gives the necessary processing information to the actual processing aggregation program 212 among these processing data and process management information. In addition, the actual process counting program 212 acquires each process data and a device constant from the QC database 232 as needed. The actual processing aggregation program 212 performs necessary data processing or aggregation based on the received information, and stores the result in the data temporary storage unit 150. The processing data stored in the data temporary storage unit 150 is suitably used in the control calculation program 211 as described above.
    Next, based on FIG. 10, the flow of a process in this embodiment is demonstrated according to a specific example. 10 is a processing flow when the processing time is calculated in the film forming process. Based on the process information acquired from the process flow information, the control calculation selection execution unit 140 selects one control variable calculation program 210 from among the plurality. The processing contents in the control variable calculation program 210 at this time are (1) the target film thickness is read from the process flow information, and (2) the control variables are determined from the apparatus (device name) and processing contents (recipe name). The film formation rate at that time is read out, and the film formation time is calculated based on the calculation formula (3). The obtained calculation result is downloaded to the control part of the semiconductor manufacturing apparatus 400 or the semiconductor test | inspection apparatus 402 via the control variable transmission / reception part 130. FIG.
    As described above, according to the semiconductor processing step control system according to the present embodiment, the process control main body unit 100 which controls the semiconductor processing step without depending on the semiconductor manufacturing apparatus 400 or the semiconductor inspection device 402, and The control variable calculation program 210 is configured by dividing the semiconductor manufacturing apparatus 400 or the semiconductor inspection device 402 and the control variable calculation program 210 which obtains a control variable suitable for the processing target to be performed accordingly. Since the plug is used for the part 100, even if the semiconductor manufacturing apparatus 400, the semiconductor processing apparatus 402, or the processing target is changed, it can respond easily to these changes.
    That is, even in the case where the processing target of one semiconductor manufacturing apparatus 4OO is changed, it is only necessary to change the control variable calculation program 210 corresponding to the semiconductor manufacturing apparatus 400, so that the other semiconductor manufacturing apparatus 400 ) And other semiconductor inspection apparatus 402 without affecting. Therefore, the system can be changed without stopping the operation of the other semiconductor manufacturing apparatus 400 or the other semiconductor inspection apparatus 402.
    [2nd Embodiment]
    The second embodiment of the present invention is composed of a process control body unit, a control variable calculation method program and a control variable calculation program, and the control variable calculation method program appropriately starts a plurality of control variable calculation programs connected thereto. The control over the process can be performed. In more detail, it demonstrates below.
    The structural block of this embodiment is shown to FIG. 11 (a). The control variable calculation method program 220 is plugged in to the process control body unit 100, and a plurality of control variable calculation programs 210 are plugged into the control variable calculation method program 220 as well. The control variable calculation program 210 is provided corresponding to each process. This control variable calculation method program 220 comprises the control variable calculation method means in this embodiment.
    The process control main body 100 and the control variable calculation program 210 have the same functions as those in the first embodiment, but differ in that the control variable calculation method program 220 is applied therebetween. The control variable calculation method program 220 has a function of managing the control variable calculation program 210 for process control over a plurality of processes.
    An example of the operation of the present embodiment is shown in Fig. 11B. In this example, control variable calculations are performed for three steps of step i, step j, and step k. The control variable calculation method program 220 manages the related information between these three steps, and the control variable calculation program 210 ( n, i), 210 (n, j), and 210 (n, k) are appropriately starting. In this way, the control variable calculation program 220 can collectively manage the control variable calculation program 210 corresponding to each of the plurality of steps. The control variable calculation method program 220 is characterized in that, in addition to combining and managing the plurality of control variable calculation programs 210, a calculation method covering a plurality of processes can also be described. In addition, it is the same as that of 1st Embodiment to consider including a test | inspection in "process."
    The control variable calculation program 210 includes a calculation managing unit 210A for managing the flow of the order and processing for calculating the control variable and a calculation formula unit 210B used for calculating the control variable, as shown in FIGS. 12A and 12B. The division into) is the same as that of the first embodiment. The control variable calculation method program 220 includes a plurality of step calculation method units 221 for describing a method of calculation that spans a plurality of steps. If the calculation method is different, the control variable calculation method program 220 may be used interchangeably.
    In this embodiment, since it is the same as that of 1st embodiment except the control variable calculation method program 220, detailed description of other parts is abbreviate | omitted.
    In this embodiment, the flow of the whole data is shown in FIG. Here, the control variable calculation program 210 is separated into the control calculation program 211 and the actual processing aggregation program 212 similarly to the first embodiment.
    The flow of processing in the present embodiment will be described. The process flow information is acquired by the flow information acquisition unit 120 and passed to the control calculation selection execution unit 140 through the process determination unit 110. And based on the instruction | command of the control calculation selection execution part 140, the control variable calculation method program 220 selects the control variable calculation program 210 ((alpha)), and starts it suitably. At this time, the control variable calculation method program 220 selects the control variable calculation program 210 (α) based on the process flow information acquired from the process flow information.
    The control variable calculation program 210 (α) performs a process similar to that described in FIG. 9 in the above-described first embodiment, obtains a calculation result from the control calculation program 211 (α), and the semiconductor manufacturing apparatus. Pass control parameters to 400A. The calculation result of the control calculation program 211 (α) is stored in the data temporary storage unit 150.
    The process data obtained by the semiconductor manufacturing apparatus 400A is transmitted to the actual process aggregation program 212 ((alpha)). In the actual processing aggregation program 212 ( ), The processing data are aggregated and the calculation result is stored in the data temporary storage unit 150.
    Next, in the same order, the control variable calculation program 220 selects the control variable calculation program 210 (β) and starts it appropriately. The processing content in the control variable calculation program 210 (β) is that the test result data of the film thickness is acquired from the semiconductor inspection device 402B and stored in the data temporary storage unit 150.
    In a next step, based on the process flow information at this time, the control variable calculation method program 220 selects the control variable calculation program 210 (γ) and starts it. In this example, the control variable calculation program 210 (γ) is used for the inspection data of the film thickness stored in the data temporary storage section 150 and the latest device constants obtained from the QC database (here, the processing speed, in particular the etching rate). From this, a constant calculation is performed to calculate the etching time. This calculation result is sent to the control unit of the semiconductor manufacturing apparatus 400 or the semiconductor inspection apparatus 402 via the control variable transmission / reception unit 130 as a control variable.
    At this time, the control variable calculation method program 220 starts up the control variable calculation program 210 (β) and the control variable calculation program 210 (γ) and associates data therebetween. Specifically, the control variable calculation technique program 220 transmits the shared data information to the data temporary storage section 150 and manages the data temporary storage section 150. Further, the control variable calculation method program 220 transmits the start control information to the control variable calculation program 210 (β) and the control variable calculation program 210 (γ) through the program start management function unit 234. Send. The startup control information is information for exclusively starting each program.
    As described above, according to the semiconductor processing process control system according to the present embodiment, the control variable calculation method program 220 is configured to be inserted and inserted into the process control body unit 100 so that the control variable calculation method program 220 is inserted. In this way, since the control variable calculation program 210 can be removed and plugged in, control over a plurality of processes can be easily performed.
    In addition, similarly to the first embodiment described above, the process control main body 100 and the semiconductor manufacturing apparatus 400 which control the semiconductor processing process without depending on the semiconductor manufacturing apparatus 400 or the semiconductor inspection apparatus 402. The control variable calculation program 210 is divided into a semiconductor test apparatus 402 and a control variable calculation program 210 for obtaining a control variable suitable for a processing target performed by the semiconductor inspection device 402 and a control variable calculation method program 220. Since it is used by plugging into the process control main body 100 through the control variable calculation method program 220, even if the semiconductor manufacturing apparatus 400, the semiconductor processing apparatus 402, or a process target changes, these changes are made. Can be easily responded to.
    [Third embodiment]
    According to a third embodiment of the present invention, a correspondence information data portion indicating correspondence between logical step processing and physical step processing is provided in a semiconductor processing step control system, and the processing of each physical step can be associated with the logical step.
    The configuration of this embodiment is not particularly changed from the second embodiment except that the corresponding information data section is provided.
    Hereinafter, the example at the time of performing the etching process of several film in this embodiment is demonstrated. FIG. 14 shows process flow information and physical step information (combination information of control parameters in each physical step), and FIG. 15 shows a method of calculating the processing time.
    As shown in Fig. 14 and Fig. 15, the process flow information includes etching the film A (film type A1, film thickness A2) and film B (film type B1, film thickness B2) to be processed simultaneously under condition D. The process of etching the film C (film type C1, film thickness C2) under condition E is described. That is, the process flow information describes a process of sequentially etching the process under two different conditions in one process.
    Two steps directly connected to each processing condition at this time are referred to as logical steps. That is, in this case, simultaneously etching the film A and the film B becomes one logic step, and etching the film C becomes one logic step. The realization of these two logic steps is performed by performing four physical steps which added the step which aims at stabilizing the process before each etching process.
    By referring to the logical / physical step management table provided in the correspondence information data section, it is assumed that the first logical step and the control condition D correspond to the second physical step, and the second logical step and the control condition E correspond to the fourth physical step, respectively. It turns out. Based on these correspondences, the etching rate is obtained by referring to the rate table in the QC database 232 (see FIG. 9). Then, processing time F and G in the first logic step and the second logic step are calculated from the target etching film thickness (depth) and the etching rate. Here, this calculation formula is inserted into the control variable calculation program 210 and used for calculation. The calculated processing time F becomes the processing time of the second physical step, and the processing time G becomes the processing time of the third physical step.
    As described above, according to the semiconductor processing process control system according to the present embodiment, the logical steps shown in the process flow information correspond to the physical steps according to the actual operation of the semiconductor manufacturing apparatus 400 or the semiconductor inspection apparatus 402. You can. For this reason, control of the semiconductor manufacturing apparatus 400 and the semiconductor inspection apparatus 402 can be performed reliably.
    [4th Embodiment]
    In a fourth embodiment of the present invention, the second embodiment described above is modified to determine whether the actual processing calculation program may omit the step.
    The process flow for demonstrating this embodiment concretely is shown in FIG. 16, the data flow is shown in FIG. 17, and the example of the computer program used is shown in FIG.
    In the example of FIG. 16, the process is made up of three processes: a CVD film forming step, a water washing treatment step, and a dust inspection step. And although the water washing process is performed for the purpose of removing the dust generate | occur | produced in the film-forming process, when the amount of dust detected by the dust inspection process is small, it is thought that it will make judgment to omit the water washing process. That is, in the aggregation result of the real processing calculation program 212 ((epsilon)) in a dust test process, when a dust seems to be below a predetermined reference value and a predetermined reference value, the water washing process process is skipped. That is, the washing process is skipped.
    As shown in FIG. 17, the film formation process, the water washing process, the dust inspection process, and each process flow information (apparatus name, recipe name, processing time) are acquired by the flow information acquisition unit 120, respectively, and control calculation selection is performed. Sent to execution unit 140, an appropriate control variable calculation program 220 is selected. The control variable calculation method program 220 activates the control variable calculation program 210 (δ) of the water washing process. Thereby, the water washing process is performed in the semiconductor manufacturing apparatus 400. The processing data is aggregated in the actual processing aggregation program 212 (δ). This actual processing counting program 212 (δ) acquires data of the amount of dust in the previous lot in the data temporary storage unit 150, and determines whether or not to omit the process based on the calculation formula of the appropriate process omission determination. Do it.
    In the next step, the control variable calculation program 220 starts the control variable calculation program 210 (epsilon). As a result, the inspection of the dust is performed in the semiconductor inspection apparatus 402. The processing data is aggregated in the actual processing aggregation program 212 (ε). That is, this real process counting program 212 (epsilon) acquires data of the amount of dust from the semiconductor inspection apparatus 402 which is a dust inspection apparatus. Subsequently, this actual processing counting program 212 (epsilon) is stored in the data temporary storage part 150 of this dust amount. This dust amount data is used for judging whether or not to omit the water treatment step in the subsequent lot as described above.
    In this way, the integration operation of the two actual processing aggregation programs 212 (δ) and (212) (ε) is performed by the control variable calculation method program 220. This control variable calculation method program 220 transmits to the management of the data temporary storage part 150 and the program processing management function part 234 to a real process aggregation program.
    As described above, according to the semiconductor processing step control system according to the present embodiment, the inspection result in the inspection step is aggregated, and whether or not the previous washing treatment step or the like can be omitted based on the inspection result. Since the judgment is made, it is possible to make a systemic determination of whether the water washing treatment step or the like which has been previously judged by a human can be omitted. For this reason, systemization of the control of a semiconductor processing process can be promoted, and furthermore, construction period can be shortened and cost can be aimed at.
    [5th Embodiment]
    5th Embodiment of this invention is a process skip apparatus provided with the determination part of the process skip which judges a process skip as an external plug-in which is easily removable. Hereinafter, this embodiment is explained in full detail.
    The functional block of this embodiment is shown in FIG. 19, and the computer (hardware) in which this function is implemented is shown in FIG. The process skipping device 70 includes a skip determination request receiving unit 71, a skip determination granting unit 72, a determination executing unit 73, a determination result receiving unit 74, and a skip executing unit 75. ), The judgment result registration unit 76, the skip condition database 77, and the know-how database 78 are included. Here, the detachable determination plug-in 80 is coupled to the process skip device 70. In addition, the process skip device 70 is connected to an external system 79 via a know-how database 78.
    The operation in the present embodiment will be described in the following order based on the specific examples. The skip determination request based on the lot processing start information is received by the skip determination request receiver 71. Based on this request, the skip determination unit 72 searches for a skip condition database 77 in which the type of the semiconductor device, the name of the judgment plug-in to be used for the skip determination of the process, and the like are registered, and the decision plug-in corresponding to the process is performed. Find 80.
    The judgment execution part 73 which received the retrieved information starts the corresponding judgment plug-in 80, and makes a judgment whether to skip a process. The determination result of the determination plug-in 80 is received by the determination result receiving unit 74, and the process skip is executed by the skip execution unit 75. In addition, the determination result register unit 76 records the history of the skip determination in the know-how database 78, so that the information to the external system 79 can be provided.
    Next, based on FIG. 20, the hardware structure of the process skip apparatus which concerns on this embodiment is demonstrated. The process skip device according to the present embodiment includes a process skip determination device 90, a process progress terminal 91, a process management database 92, a QC database 93, and an external system 79. It is configured by interconnecting via a network bus.
    In addition, the process skip determination apparatus 90 includes a CPU 90a, a RAM 90b, a local disk 90c, a cache database 90d, and a know-how database 78. .
    In the CPU 90a, a process skip determination program and a program of the determination plug-in 80 are executed. In the RAM 90b, a process skip determination program and a program of the determination plug-in 80 are stored. The OS and various programs are stored in the local disk 90c. QC results are temporarily stored in the cache database 90d. In the know-how database 78, the determination result of whether to skip a process is stored. The process management information is stored in the process management database 92. QC data is stored in the QC database 93.
    As described above, according to the semiconductor processing step control system according to the present embodiment, since the determination plug-in 80 is configured to be inserted into and out of the process skipping device 70, it is possible to easily cope with a change in the determination logic.
    [Sixth embodiment]
    In a sixth embodiment of the present invention, in the detachable judgment plug-in, acquisition of QC (quality control) data and determination of process skip based on the data are performed.
    21 is a diagram illustrating a functional block diagram of the process skip device and the judgment plug-in according to the present embodiment. As shown in FIG. 21, the determination plug-in 80 includes a spec database 81, a spec search unit 82, a QC result extraction unit 83, a skip determination unit 84, and a cache database ( 90d). Information from the QC (quality information) database 93 is input to the QC result extraction unit 83.
    Next, with reference to FIG. 21 based on FIG. 22-27, operation | movement in this embodiment is demonstrated sequentially based on a specific example. 22 to 27 are diagrams showing examples of specific processing in the present embodiment.
    As shown in Fig. 22, a skip determination request based on the lot processing start information is received by the skip determination request receiving unit 71. In this case, it is determined whether or not to skip step β of the variety AAAA of the semiconductor.
    Next, as shown in FIG. 23, the skip determination unit 72 selects the skip condition database 77 in which the type of the semiconductor device, the name of the judgment plug-in used for the skip determination of the process, and the like are registered. The search finds the judgment plug-in 80 corresponding to the process. In the skip determination database 77, the types of semiconductors, skip decision availability information (information of whether or not to perform the skip determination itself) for each process, and names of logics (judgment plug-in names) used for skip determination are registered. The judgment plug-in 80 is found by the judgment plug-in name. In this example, the judgment plug-in 80 is named SAKURA.
    Next, the judgment execution unit 73 starts SAKURA among the corresponding judgment plug-ins 80. At this time, the judgment logic of the judgment plug-in 80 does not contain specific numerical values in the judgment specifications D, E, F, and G as shown in FIG. For this reason, as shown in FIG. 25, the spec search part 82 acquires the judgment specification used as a criterion of a skip determination from the specification database 81, and substitutes into decision logic based on input information. In this example, if the film thickness to be judged is entered four times in a row between 1000 and 1100 angstroms, the skip of the step is allowed.
    Next, as shown in FIG. 26, the QC result extracting unit 83 obtains previous quality information of the target process from the QC (quality control) database 93 and registers it in the cache database 85 ( Preservation).
    Next, as shown in FIG. 27, the skip determination unit 84 determines whether to skip the target process with reference to the data in the cache database 85, and transmits the determination result to the determination result receiving unit 74. do. In response to this, the skip execution unit 75 skips the process. That is, in this example, the treatment process (for example, water washing process) which is process (beta) is skipped.
    Moreover, it is also possible to cancel the skip of this process (beta). That is, in the inspection process of the process (gamma) which is the next process of the process (beta), when the amount of dust exceeding a predetermined | prescribed reference range is detected, it is also possible not to skip the water washing process of the process (beta).
    As a result of the determination, the history of the skip determination by the registration unit 76 is recorded in the know-how data face 78. This history is then provided to the external system 90 via the know-how database 78. An example of utilization of this history is shown in FIG. Here, the lot schedule management system 90a is taken as an external system 90 as an example. The lot schedule management system 90a performs rescheduling based on the history of this know-how database 78. In other words, by skipping step β, the number of steps in the entire process flow is reduced. For this reason, the delivery date of the product can be shortened. In the example of FIG. 28, the delivery date is XX days, indicating that the date is YY days by skipping the step β. In this way, by utilizing the history information of the know-how database 78, it is possible to perform schedule management of the processing step with high precision.
    As described above, according to the semiconductor processing process control system according to the present embodiment, the judgment plug-in 80 obtains past quality information from the QC database 93 and based on the judgment specification of the specification database 81. Since it is decided whether or not the past quality information satisfies the conditions of the step skip, it is possible to accurately determine whether or not to skip the processing step with high stability of the finishing result and not need. For this reason, construction period can be shortened and lot manufacturing cost can be reduced.
    Moreover, since the judgment plug-in 80 is comprised so that the process skip apparatus 70 can be pulled out and plugged in, it can externally provide the logic which judges whether the process can be skipped from the finishing result. For this reason, it is possible to flexibly change or add logic of judgment.
    In addition, this invention can be variously modified without being limited to the said embodiment. For example, at least one of the control calculation program 211 and the actual processing aggregation program 212 of the control variable calculation program 210 shown in FIG. 6 can be omitted if unnecessary.
    In addition, each process described above can also be recorded and distributed on a computer-readable recording medium which records the procedure necessary for the process. In this case, the semiconductor processing process control system according to the present invention can be realized by reading and executing a program recorded on the recording medium into a computer.
    As described above, according to the present invention, there is provided a semiconductor processing apparatus for controlling a semiconductor processing process irrespective of the semiconductor processing apparatus and the processing target, and a semiconductor processing apparatus and a semiconductor processing apparatus suitable for the processing target. In addition to dividing the control variable into control variable calculation means, the control variable calculation means can be pulled out and plugged into the process control main body as needed. You can respond quickly. For this reason, it is possible to operate the production line early in the production of small quantities of many kinds of semiconductor devices.
    In addition, since the control variable calculation means is configured to be pulled out and plugged into the process control body part, the control variable calculation method is configured to allow the control variable calculation means to be pulled out and inserted. It can be done separately. For this reason, even when a new operation or change occurs between the steps, the change to cope with this can be easily performed, and the control variable calculation in the production line of the semiconductor device can be automated quickly.
    权利要求:
    Claims (14)
    [1" claim-type="Currently amended] A process control body unit which controls the semiconductor processing process regardless of the semiconductor processing apparatus and the processing target; And
    Control variable calculating means for obtaining control variables of the semiconductor processing apparatus suitable for the semiconductor processing apparatus and the preprocessing target, and a plurality of control variable calculating means existing according to the semiconductor processing apparatus and the processing target;
    At the same time,
    The control variable calculating means is configured to be able to be pulled out and inserted into the process control main body as necessary.
    [2" claim-type="Currently amended] A process control body unit which controls the semiconductor processing process regardless of the semiconductor processing apparatus and the processing target;
    A plurality of control variable calculating means for obtaining control variables of the semiconductor processing apparatus and the semiconductor processing apparatus suitable for the processing target; And
    Control variable calculation method means for managing the plurality of control variable calculation means in accordance with a calculation method that spans a plurality of predetermined processing steps
    At the same time,
    The control variable calculation method means is configured to be able to be pulled out and plugged in with the process control main body, if necessary,
    And said control variable calculating means is configured to be able to be pulled out and inserted as needed, and said control variable calculating method means.
    [3" claim-type="Currently amended] The method according to claim 1 or 2,
    A control calculation unit, in which the control variable calculation unit calculates only the control variable of the semiconductor processing apparatus; And
    An actual processing counting unit that performs calculation based on processing data from the semiconductor processing apparatus;
    Semiconductor processing process control system comprising a.
    [4" claim-type="Currently amended] The method according to any one of claims 1 to 3,
    A calculation manager configured to control the flow of control variable calculation processing by the control variable calculation means; And
    Calculation formula section consisting of a set of calculation formulas used by the calculation management section
    Semiconductor processing process control system comprising a.
    [5" claim-type="Currently amended] The method of claim 1,
    A flow information acquisition unit for acquiring process flow information by the process control main body;
    A process determination unit for acquiring the specific information specifying the semiconductor processing apparatus, the process contents, and the process state from the process flow information;
    A control calculation selection execution unit for selecting and starting a control variable calculation means suitable for it based on the specific information; And
    A control variable transmitter which receives the control variable obtained by the calculation of the activated control variable calculating means and sends it to the semiconductor processing apparatus;
    Semiconductor processing process control system comprising a.
    [6" claim-type="Currently amended] The method of claim 5,
    And the control variable calculating means has a function of acquiring information on the processing speed based on the specific information and calculating the processing time from the processing speed.
    [7" claim-type="Currently amended] The method of claim 6,
    When the control variable calculation means acquires the information of the processing speed, processing conditions and processing target film types are obtained from the processing contents in the specific information, and processing is performed based on these processing conditions and processing target film types. Acquiring the information of the speed, the semiconductor processing process control system.
    [8" claim-type="Currently amended] The method according to any one of claims 1 to 7,
    And a corresponding information data section having corresponding data between the logical step processing corresponding to the processing condition and the physical step processing consisting of all the processing steps necessary for the control of the semiconductor processing apparatus based on the logical step processing. A semiconductor processing process control system.
    [9" claim-type="Currently amended] The method according to any one of claims 1 to 8,
    The control variable calculation means,
    First control variable calculation means having a function of acquiring the processing data by the semiconductor processing apparatus and storing it in the data temporary storage section; And
    Second control variable calculation means having a function of judging whether or not a part of the processing step is omitted based on the processing data stored in the data temporary storage unit;
    Semiconductor processing process control system comprising a.
    [10" claim-type="Currently amended] A skip determination request receiving unit for receiving a request for eliminating the process;
    A plurality of detachable decision plug-ins having process elimination decision logic corresponding to each process;
    A skip determination unit for searching for a determination plug-in corresponding to the omission determination target process and a determination execution unit for starting the determination plug-in;
    A determination result receiver configured to receive a process omission determination result of the determination plug-in; And
    Skip execution unit that skips the process when it is determined that the process omission determination result can be omitted.
    Semiconductor processing process control system comprising a.
    [11" claim-type="Currently amended] The method of claim 10,
    The judgment plug-in,
    A specification database consisting of a set of reference specifications for determining a process omission;
    A specification search unit which obtains a reference specification from a specification database according to an instruction from the determination execution unit and sends the reference specification to a skip determination unit;
    A QC result extraction unit which obtains quality information from an external quality control database and sends it to a skip determination unit; And
    A skip judging unit having decision logic for judging a process omission, and making a decision to omit a process based on the reference specification and the quality information.
    Semiconductor processing process control system comprising a.
    [12" claim-type="Currently amended] The method according to claim 10 or 11, wherein
    A know-how database that accumulates the results of the process omission determination; And
    Transmitting means for transmitting the data of the know-how database to the outside;
    Semiconductor processing process control system comprising a.
    [13" claim-type="Currently amended] It is a semiconductor processing process control method of controlling a some semiconductor processing apparatus,
    A process determination step of acquiring the specific information specifying the semiconductor processing apparatus, the process contents, and the process state to be processed from the process flow information;
    A control calculation selection execution step of selecting a control variable calculation suitable for it based on the specific information among the plurality of control variable calculations different for each of the semiconductor processing apparatus, the processing contents, and the process state, and performing the calculation; And
    A control variable transmission step of receiving a control variable obtained by the control variable calculation and sending it to the semiconductor processing apparatus.
    Semiconductor processing process control method comprising a.
    [14" claim-type="Currently amended] A recording medium in which a program for controlling a plurality of semiconductor processing apparatuses is recorded,
    A process determination step of acquiring the specific information specifying the semiconductor processing apparatus, the process contents, and the process state to be processed from the process flow information;
    A control calculation selection execution step of selecting a control variable calculation suitable for it based on the specific information among the plurality of control variable calculations different for each of the semiconductor processing apparatus, the processing contents, and the process state, and performing the calculation; And
    A control variable transmission step of receiving a control variable obtained by the control variable calculation and sending it to the semiconductor processing apparatus;
    A computer-readable recording medium having recorded thereon a program for causing a computer to run.
    类似技术:
    公开号 | 公开日 | 专利标题
    DE102015101370A1|2015-08-06|Managing big data in process control systems
    DE3416939C2|1992-01-09|
    US5960441A|1999-09-28|Systems and methods for providing dynamic data referencing in a generic data exchange environment
    KR20150123872A|2015-11-04|Generalized virtual inspector
    US6738747B1|2004-05-18|Method and apparatus for forming a production plan
    DE60220063T2|2008-01-10|Integration of fault recognition with run-to-run control
    EP1250632B1|2005-01-19|System and method for determining the overall equipment effectiveness of production plants, failure events and failure causes
    US4901242A|1990-02-13|System for managing production of semiconductor devices
    US6952656B1|2005-10-04|Wafer fabrication data acquisition and management systems
    TWI221627B|2004-10-01|Method and apparatus for cascade control using integrated metrology
    EP1330685B1|2012-12-12|Testing method and testing device for starting up systems which are controlled by means of a program logic
    US7181354B1|2007-02-20|Method and apparatus for data stackification for run-to-run control
    US6477432B1|2002-11-05|Statistical in-process quality control sampling based on product stability through a systematic operation system and method
    TWI427722B|2014-02-21|Advanced process control system and method utilizing virtual metrology with reliance index and computer program product thereof
    TWI549007B|2016-09-11|Method for searching and analyzing process parameters and computer program product thereof
    US9285799B2|2016-03-15|Methods and apparatus to dynamically display data associated with a process control system
    TWI287244B|2007-09-21|Correlation of end-of-line data mining with process tool data mining
    KR900001033B1|1990-02-24|Sequence controller
    US7213478B2|2007-05-08|Method for automatic configuration of processing system
    TWI453789B|2014-09-21|Product-related feedback for process control
    US7676295B2|2010-03-09|Processing information management in a plasma processing tool
    US20050143849A1|2005-06-30|Controlling method for manufacturing process
    JP2004031709A|2004-01-29|Waferless measuring recipe generating system
    EP2098983A1|2009-09-09|Methods and apparatus to standardize data properties in a process control environment
    EP2042958A2|2009-04-01|Adaptive industrial systems via embedded historian data
    同族专利:
    公开号 | 公开日
    US6853870B2|2005-02-08|
    CN1262946C|2006-07-05|
    JP2001015398A|2001-01-19|
    US20040186610A1|2004-09-23|
    US6745094B1|2004-06-01|
    CN1776665A|2006-05-24|
    TW494462B|2002-07-11|
    KR100403103B1|2003-10-23|
    CN1280343A|2001-01-17|
    CN100416549C|2008-09-03|
    JP3998372B2|2007-10-24|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1999-06-30|Priority to JP1999-186523
    1999-06-30|Priority to JP18652399A
    2000-06-29|Application filed by 니시무로 타이죠, 가부시끼가이샤 도시바
    2001-04-16|Publication of KR20010029860A
    2003-10-23|Application granted
    2003-10-23|Publication of KR100403103B1
    优先权:
    申请号 | 申请日 | 专利标题
    JP1999-186523|1999-06-30|
    JP18652399A|JP3998372B2|1999-06-30|1999-06-30|Semiconductor processing process control system, semiconductor processing process control method, and recording medium recording process for the same|
    [返回顶部]